Powerful and Versatile: The Infrared Reflow Oven Furnace is your ultimate solution for efficient and precise soldering. With 800W of power and a spacious soldering area of 180 x 235 mm, it can handle various encapsulation forms for single and double PCB panels.
Microcomputer Automatic Control: This reflow soldering machine takes care of the entire welding process, from preheating to soaking, reflux, and cooling. Its automatic control system ensures hassle-free operation and reliable results.
Precise and Efficient: Bga rework station With a temperature range of 100℃ - 350℃ and a cycle time of 1-8 minutes, this oven provides precise and efficient soldering. The fast infrared heating and uniform temperature fan guarantee accurate and uniform temperature distribution.
Memory Function and Forced Heating/Cooling: Store up to eight temperature parameter waves in the memory and choose the optimal settings for your soldering needs. The forced heating and cooling function enhances efficiency and flexibility.
Versatile Functionality: This reflow oven integrates various functions such as reflow soldering, drying, insulation, shaping, and rapid cooling. It can handle different packaging forms, such as CHIP, SOP, PLCC, QFP, BGA, and more. It is also suitable for tasks like quartz chip repair, product adhesive curing, circuit board thermal aging, and PCB board maintenance.
Wide Application: The Infrared Reflow Oven Furnace caters to the needs of enterprises, companies, and research institutions for research and small batch production. Its versatility makes it suitable for a wide range of applications.
